Mochini oa tlhahlobo ea solder oa JUKI 3D RV-2

Likaroloana:

Sistimi e Hlakileng ea Pono ea Pono

Ts'ebetso ea maemo a holimo lefatšeng ka bophara

Lebelo la ho hlahloba = 0.2 sec / foreimi

Lenaneo le bonolo

CCC ( Central Confirmation Control)*

SPC ( Taolo ea Ts'ebetso ea Lipalopalo) *

E tšehetsa tlhahlobo ea 3D *

Inthaneteng therisano Iteanye le rona

Lintlha tsa Sehlahisoa

Lebitso la mohlala			RV-2
Boholo ba PWB			50mm×50mm – 410mm×360mm 630mm×360mm(boholo bo bolelele ba PWB)*
Likaroloana			0402* / 0603(metric), Cylindrical chip, tantalum capacitor, transistor, SOP / QFP, joalo-joalo.
FOV(ka ho fetisisa)	2D		0.2s / foreimi
	i-3D SPI	2D+3D tlhahlobo	0.50s / foreimi (4frame)
	e-3D AOI	2D+3D tlhahlobo	0.55s / foreimi (4frame)
Qeto ea tlhahlobo			15μm (Resloution e Tloaelehileng), 10μm (Boemo bo phahameng)*
Ntho ea ho hlahloba			Karolo e sieo, phalliso ea boemo, Polarity, Kapele/ka morao ho khutlela morao, Unsoldered,Borokho, Bongata ba solder, Khaello ea karolo ea ho kenya, Temoho ea Sebopeho*