AOI-SPI
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Mochini oa tlhahlobo ea JUKI 3D, mochini oa tlhahlobo ea pono oa boto ea 3D RV-2-3DH(AOI/SPI)
Lebelo le leholo
Ntlafatso e kholo ea mahlale a tlhahlobo a nang le pixel e phahameng (lipikselse tse limilione tse 12)
Ho nepahala ho tsotehang
Ho sebelisa lilense tse nang le qeto e phahameng ho ntlafatsa ho nepahala ha tlhahlobo ea likaroloana tsa Ultra-compact
Bonolo ba tšebeliso ea litekanyetso
Mekhoa ea ts'ebetso e bonolo ho e sebelisa le ho e etsa, ho tloha ho ba qalang ho ea ho batho ba baholo
Boiketsetso ba tlhahlobo ea pono
Letoto la RV, le ka sebelisetsoang ho lekanya
Bakeng sa ho ntlafatsa katleho ea semela kaofela
Ho fihlela katleho ea feme eohle ka khokahano ea sistimi
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Mochini oa tlhahlobo ea peista ea JUKI 3D, mochini oa tlhahlobo ea pono oa boto ea 3D(AOI/SPI) RV-2-3D
Ho tseba ho potlakisa yuniti ea morao-rao ea 3D.Ho fihlella 0.41 sec / FOV le ntlafatso ea 34% ha ho bapisoa le mofuta o fetileng.
Qeto ea bophahamo 0.1 μm, Pheta-pheta 10 μm *Ho hlokomela ntlafatso e nepahetseng ea bohlokoa.Ka nts'etsopele ea theknoloji e ncha, fumana setšoantšo sa 3D se hlakileng le se phahameng.
Ntle le template ea 2D e fetileng le mokhoa oa ts'ebetso, o kentse mokhoa o mocha oa 3D template.
Ho feta moo, nts'etsopele ea algorithm e ncha bakeng sa tlhahlobo ea fillet.* 0402 setšoantšo
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Mochini oa tlhahlobo ea solder oa JUKI 3D RV-2
Sistimi e Hlakileng ea Pono ea Pono
Ts'ebetso ea maemo a holimo lefatšeng ka bophara
Lebelo la ho hlahloba = 0.2 sec / foreimi
Lenaneo le bonolo
CCC ( Central Confirmation Control)*
SPC ( Taolo ea Ts'ebetso ea Lipalopalo) *
E tšehetsa tlhahlobo ea 3D *