Ts'ebetso ea ho kopanya e sa lefelloeng ea lead e na le litlhoko tse phahameng haholo ho PCB ho feta ts'ebetso e thehiloeng ho lead.Ho hanyetsa mocheso oa PCB ho molemo, mocheso oa phetoho ea khalase Tg o phahame, tekanyo ea ho atolosa mocheso e tlaase, 'me litšenyehelo li tlaase.
Litlhoko tsa ho soasoa tse sa keneng ka pele bakeng sa PCB.
Ho reflow soldering, Tg ke thepa e ikhethang ea li-polymers, e khethollang mocheso o boima oa thepa ea thepa.Nakong ea ts'ebetso ea SMT soldering, mocheso oa soldering o phahame haholo ho feta Tg ea substrate ea PCB, 'me mocheso o sa lefelloeng oa soldering o phahame ho 34 ° C ho feta o nang le lead, e leng ho nolofalletsang ho senyeha ha mocheso oa PCB le ho senyeha. ho likaroloana nakong ea ho pholisa.Thepa ea motheo ea PCB e nang le Tg e phahameng e lokela ho khethoa ka nepo.
Nakong ea tjheseletsa, haeba mocheso o ntse o eketseha, Z-axis ea sebopeho sa multilayer PCB ha e lumellane le CTE pakeng tsa thepa ea laminated, fiber ea khalase, le Cu ka tataiso ea XY, e tla hlahisa khatello e ngata ho Cu, le ho maemong a matla, e tla etsa hore ho hloekisoa ha lesoba la metallized ho robehe le ho baka mefokolo ea welding.Hobane e ipapisitse le mefuta e mengata, joalo ka nomoro ea lera la PCB, botenya, thepa ea laminate, curve ea soldering, le kabo ea Cu, ka geometry, jj.
Ts'ebetsong ea rona ea 'nete, re nkile mehato e meng ea ho hlola ho robeha ha lesoba la metallized la boto ea multilayer: mohlala, fiber ea resin / khalase e ntšoa ka har'a sekoting pele ho ts'oaroa ha electroplating ts'ebetsong ea recess etching.Ho matlafatsa matla a tlamahano pakeng tsa lerako la lesoba la metallized le boto ea li-multi-layer board.Botebo ba etch ke 13 ~ 20µm.
Mocheso o lekanyelitsoeng oa FR-4 substrate PCB ke 240°C.Bakeng sa lihlahisoa tse bonolo, mocheso o phahameng oa 235 ~ 240 ° C o ka finyella litlhoko, empa bakeng sa lihlahisoa tse rarahaneng, ho ka 'na ha hlokahala 260 ° C ho rekisoa.Ka hona, lipoleiti tse teteaneng le lihlahisoa tse rarahaneng li hloka ho sebelisa mocheso o phahameng oa FR-5.Hobane litšenyehelo tsa FR-5 li batla li le holimo, bakeng sa lihlahisoa tse tloaelehileng, likarolo tse kopaneng tsa CEMn li ka sebelisoa ho nkela li-substrates tsa FR-4 sebaka.CEMn ke laminate e thata e entsoeng ka koporo e entsoeng ka lisebelisoa tse fapaneng.CEMn ka bokhutšoane e emetse mefuta e fapaneng.
Nako ea poso: Jul-22-2023