Mabaka a ka sehloohong a ho futhumatsa ho sa tšoaneng ha likarolo tsa SMT lead-free reflow soldering process ke: lead-free reflow soldering product load, conveyor lebanta kapa heater edge edge influence, le ho se tšoane ha matla a mocheso kapa ho monya mocheso oa likarolo tsa soldering tse se nang lead.
① Tšusumetso ea mefuta e fapaneng ea ho kenya lihlahisoa.Ho lokisoa ha sekhahla sa mocheso oa solder e se nang lead-free reflow soldering e lokela ho nahana ka ho fumana phetisetso e ntle tlasa moroalo, mojaro le lintlha tse fapaneng tsa mojaro.Ntho ea mojaro e hlalosoa e le: LF = L / (L + S);moo L=bolelele ba substrate e kopaneng le S=karohano pakeng tsa likaroloana tse kopaneng.
②Ka ontong ea reflow e se nang lead, lebanta la conveyor le boetse le fetoha mokhoa oa ho qhala mocheso ha le ntse le tsamaisa lihlahisoa bakeng sa solder e se nang lead.Ho phaella moo, maemo a ho senya mocheso a fapane moeling le bohareng ba karolo ea ho futhumatsa, 'me mocheso o bohale ka kakaretso o fokotseha.Ntle le litlhoko tse fapaneng tsa mocheso oa sebaka se seng le se seng sa mocheso sebōping, mocheso sebakeng se le seng sa mojaro o boetse o fapane.
③ Ka kakaretso, PLCC le QFP li na le matla a maholo a mocheso ho feta motsoako oa "discrete chip", 'me ho thata haholo ho kenya lisebelisoa tsa sebaka se seholo ho feta likaroloana tse nyenyane.
Ho fumana liphetho tse ka phetoang ts'ebetsong ea soldering e se nang lead-free reflow, ha karolo ea mojaro e le kholoanyane, e ba thata le ho feta.Hangata palo e kholo ea moroalo oa li-oveni tse se nang loto e tsoa ho 0.5-0.9.Sena se ipapisitse le maemo a sehlahisoa (karolo ea solder density, substrates e fapaneng) le mefuta e fapaneng ea libopi tsa reflow.Ho fumana liphetho tse ntle tsa welding le ho pheta-pheta, boiphihlelo bo sebetsang bo bohlokoa.
Nako ea poso: Nov-21-2023